Semiconductor package device and manufacturing method thereof

ABSTRACT

A method of manufacturing a semiconductor device including providing a die, forming a pad on the die, disposing a first polymer over the die, patterning the first polymer with an opening over the pad, disposing a sacrificial layer over the patterned first polymer, disposing a molding surrounding the die, removing a portion of the molding thereby exposing the sacrificial layer, removing the sacrificial layer thereby exposing the pad and the first polymer, disposing a second polymer on the first polymer, patterning the second polymer with the opening over the pad, and disposing a conductive material on the pad within the opening.

PRIORITY CLAIM AND CROSS-REFERENCE

This application claims priority to U.S. application Ser. No.14/057,539, filed on Oct. 18, 2013, entitled “Semiconductor PackageDevice and Manufacturing Method Thereof,” which application is herebyincorporated herein by reference.

BACKGROUND

Electronic equipments involving semiconductor devices are indispensablefrom our daily life. With the advancement of electronic technology,electronic equipments become more complicated and involve greater amountof integrated circuitry for executing the desired multi-functionality.Thus, manufacturing of the electronic equipment includes more and moresteps of assembly and processing as well as materials for producing thesemiconductor devices in the electronic equipments. Therefore, there isa continuous demand on simplifying the steps of production, increasing aproduction efficiency and lowering an associated manufacturing cost oneach electronic equipment.

During the operations of manufacturing the semiconductor device, thesemiconductor device is assembled with numbers of integrated componentsincluding various materials with difference in thermal properties. Assuch, the integrated components are in undesired configurations aftercuring of the semiconductor device. The undesired configurations wouldlead to yield loss of the semiconductor device, poor bondability betweenthe components or delamination of the components, etc. Furthermore, thecomponents of the semiconductor device includes various metallicmaterials which are in limited quantity and thus in a high cost. Theundesired configurations of the components and the yield loss of thesemiconductor would further exacerbate materials wastage and thus themanufacturing cost would increase.

As more different components with different materials are involved and acomplexity of the manufacturing operations of the semiconductor deviceis increased, there are more challenges to simplify the manufacturingoperations and minimize materials usage. As such, there is a continuousneed to improve the method for manufacturing the semiconductor and solvethe above deficiencies.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1 is a schematic view of a semiconductor device in accordance withsome embodiments of the present disclosure.

FIG. 2 is a schematic view of a semiconductor device with a firstrecessed portion of a first polymer in accordance with some embodimentsof the present disclosure.

FIG. 3 is a schematic view of a semiconductor device with a protrudedportion of a molding in accordance with some embodiments of the presentdisclosure.

FIG. 3A is an enlarged view of a protruded portion and an extendedportion of a molding in accordance with some embodiments of the presentdisclosure.

FIG. 4 is a schematic view of a semiconductor device with a secondpolymer in accordance with some embodiments of the present disclosure.

FIG. 5 is a schematic view of a semiconductor device with a secondrecessed portion of a second polymer in accordance with some embodimentsof the present disclosure.

FIG. 6 is a schematic view of a semiconductor device with a conductivetrace in accordance with some embodiments of the present disclosure.

FIG. 7 is a schematic view of a semiconductor device with a thirdpolymer in accordance with some embodiments of the present disclosure.

FIG. 8 is a schematic view of a semiconductor device with a bump on anunder bump metallurgy (UBM) in accordance with some embodiments of thepresent disclosure.

FIG. 9 is a schematic view of a semiconductor package in accordance withsome embodiments of the present disclosure.

FIG. 10 is a flow diagram of a method of manufacturing a semiconductordevice in accordance with some embodiments of the present disclosure.

FIG. 10A is a schematic view of a wafer with a die, a pad and a firstpolymer in accordance with some embodiments of the present disclosure.

FIG. 10B is a schematic view of a wafer with a patterned first polymerin accordance with some embodiments of the present disclosure.

FIG. 10C is a schematic view of a wafer with a sacrificial layer inaccordance with some embodiments of the present disclosure.

FIG. 10D is a schematic view of a wafer with singulated die inaccordance with some embodiments of the present disclosure.

FIG. 10E is a schematic view of a semiconductor device with a die on acarrier in accordance with some embodiments of the present disclosure.

FIG. 10F is a schematic view of a semiconductor device with a moldingcompound in accordance with some embodiments of the present disclosure.

FIG. 10G is a schematic view of a semiconductor device with an exposedsacrificial layer in accordance with some embodiments of the presentdisclosure.

FIG. 10H is a schematic view of a semiconductor device with an exposedfirst polymer in accordance with some embodiments of the presentdisclosure.

FIG. 10I is a schematic view of a semiconductor device with a conductivematerial, a second polymer and a third polymer in accordance with someembodiments of the present disclosure.

FIG. 10J is a schematic view of a semiconductor device with a bump inaccordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

A semiconductor device is manufactured by a number of operations. Duringthe manufacturing, a circuitry of a die is connected with an externalcircuitry through a conductive trace, so that the die is electricallyconnected with the external circuitry from a pad on the die to a bumpsuch as solder bump or solder ball for receiving a pad of the externalcircuitry. In order to facilitate a configuration of the conductivetrace within the semiconductor device, a copper pillar is disposedwithin the conductive trace adjacent to the surface of the pad of thedie. However, material cost of copper is high and thus manufacturingcost of the semiconductor device is increased.

Further, the die is protected by a molding compound. The moldingcompound encloses and isolates the die from the surrounding environment.Upon disposing the molding compound around the die, a stepped portion ofthe molding is formed adjacent to an edge of the die. The steppedportion would cause other components subsequently placed over the diecould not be smoothly disposed thereon, and thus delamination ofcomponents is suffered. The formation of the stepped portion of themolding compound leads to a stepping between components and thus inducea poor reliability of the semiconductor device.

In the present disclosure, a semiconductor device with a structuralimprovement is disclosed. The semiconductor device includes anadditional polymer disposed over a die and surrounded by a molding inorder to compensate a stepping of the molding adjacent to an edge of thedie and improve a smoothness of a top surface of the molding fordisposing the components thereon, and thus prevent delamination ofcomponents and improve a reliability of the semiconductor device.

The manufacturing and use of the embodiments of the present inventionare discussed in details below. It should be appreciated, however, thatthe embodiments provide many applicable inventive concepts that can beembodied in a wide variety of specific contexts. It is to be understoodthat the following disclosure provides many different embodiments orexamples for implementing different features of various embodiments.Specific examples of components and arrangements are described below tosimplify the present disclosure. These are, of course, merely examplesand are not intended to be limiting.

Embodiments, or examples, illustrated in the drawings are disclosedbelow using specific language. It will nevertheless be understood thatthe embodiments and examples are not intended to be limiting. Anyalterations and modifications in the disclosed embodiments, and anyfurther applications of the principles disclosed in this document arecontemplated as would normally occur to one of ordinary skill in thepertinent art.

Further, it is understood that several processing steps and/or featuresof a device may be only briefly described. Also, additional processingsteps and/or features can be added, and certain of the followingprocessing steps and/or features can be removed or changed while stillimplementing the claims. Thus, the following description should beunderstood to represent examples only, and are not intended to suggestthat one or more steps or features is required.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

FIG. 1 is an embodiment of a semiconductor device 100. The semiconductordevice 100 includes a die 101 disposed on a carrier 102. The die 101includes a pad 103 disposed on a surface 101 a of the die 101. A polymer105 is disposed over the die 101. The die 101 and the polymer 105 aresurrounded by a molding 104.

In some embodiments, the carrier 102 is a silicon wafer which would befabricated to become integrated circuits (IC) in subsequentmanufacturing operations. In some embodiments, the carrier 102 is acircuit board including some circuits for electrical connection ofcomponents thereon. In some embodiments, the circuit board is a printedcircuit board (PCB). In some embodiments, the carrier 102 is in acircular shape.

In some embodiments, the die 101 is a small piece includingsemiconductor materials such as silicon and is fabricated with apredetermined functional circuit within the die 101 produced byphotolithography operations. In some embodiments, the die 101 issingulated from a silicon wafer by a mechanical or laser blade and thenis placed on the carrier 102 for subsequent manufacturing operations. Insome embodiments, the die 101 is attached on the surface 102 a of thecarrier 102 by an adhesive, a tape or die attach film (DAF) etc. In someembodiments, the die 101 is in a quadrilateral, a rectangular or asquare shape.

In some embodiments, the pad 103 is a bond pad disposed on the surface101 a of the die 101 as in FIG. 1. In some embodiments, the pad 103 iselectrically connected with a circuitry external to the die 101, so thatit circuitry internal to the die electrically connects with thecircuitry external to the die 101 through the pad 103. In someembodiments, the pad 103 is configured for electrically coupling with abump through a conductive trace attached on the pad 103, so that thecircuitry internal to the die 101 connects with the circuitry externalto the die 101 from the pad 103 to the bump through the conductivetrace. In some embodiments, the bump is a solder bump, solder ball,solder paste or etc. In some embodiments, the pad 103 includes gold,silver, copper, nickel, tungsten, aluminum, palladium and/or alloysthereof.

In some embodiments, the die 101 includes a passivation 106 on thesurface 101 a of the die 101 as in FIG. 1. The passivation 106 surroundsthe pad 103. In some embodiments, the passivation 106 covers a portionof the pad 103. The passivation 106 is configured for providing anelectrical insulation and a moisture protection for the die 101, so thatthe die is isolated from ambient environment. In some embodiments, thepassivation 106 is formed with dielectric materials such as spin-onglass (SOG), silicon oxide, silicon oxynitride, silicon nitride or thelike. In some embodiments, the passivation 106 is formed with a vapordeposition or a spin coating process.

In some embodiments as in FIG. 1, the passivation 106 includes anopening 106 a above the pad 103 for exposing a portion of the pad 103and thus for electrically connecting the pad 103 with the circuitryexternal to the die 101 through the conductive trace.

In some embodiments as in FIG. 1, the polymer 105 is disposed over thedie 101 and is patterned to provide a path for the conductive tracepassing through. In some embodiments, the polymer 105 is disposed overthe passivation 106 and the pad 103 to cover the die 101. In someembodiments, the polymer 105 includes a polymeric material such asepoxy, polyimide, polybenzoxazole (PBO), solder resist (SR), ABF film,and the like.

In some embodiments as in FIG. 2, the polymer 105 is patterned byseveral operations to form a recessed portion 105 a. In someembodiments, the polymer 105 is patterned by photolithography, that aphotoresist material is disposed on the polymer 105 to cover the polymer105, and the photoresist material is partially exposed through aphotomask in order to etch away some polymer 105 above the pad 103, sothat the polymer 105 includes the recessed portion 105 a.

A term “patterning” or “patterned” is used in the present disclosure todescribe an operation of forming a predetermined pattern on a surface.The patterning operation includes various steps and processes and variesin accordance with the features of embodiments. In some embodiments, apatterning operation is adopted to pattern an existing film or layer.The patterning operation includes forming a mask on the existing film orlayer and removing the unmasked film or layer with an etch or otherremoval process. The mask is a photo resist, or a hardmask. In someembodiments, a patterning operation is adopted to form a patterned layerdirectly on a surface. The patterning operation includes forming aphotosensitive film on the surface, conducting a photolithographyprocess and a developing process. The remaining photosensitive film isretained and integrated into the semiconductor device.

In some embodiments as in FIG. 2, the patterned polymer 105 includes therecessed portion 105 a which is disposed above the pad. In someembodiments, the recessed portion 105 a is disposed above the opening106 a of the passivation 106. The opening 106 a of the passivation 106is within the recessed portion 105 a of the polymer 105. In someembodiments, the recessed portion 105 a is larger than the opening 106a. In some embodiments, the recessed portion 105 a and the opening 106 aare configured for receiving a portion of a conductive trace disposedabove the polymer 105. The pad 103 is electrically connected with thecircuitry external to the die 101 through the conductive trace bypassing through the recessed portion 105 a and the opening 106 a.

In some embodiments as in FIG. 3, the molding 104 surrounds the die 101and the polymer 105. The molding 104 is disposed adjacent to a sidewall101 b of the die 101. In some embodiments, the molding 104 includes aprotruded portion 104 b extending into the polymer 105 adjacent to anedge of the die 101. The protruded portion 104 b of the molding 104 iscoupled with the polymer 105 and the passivation 106. The protrudedportion 104 b stands on the edge of the die 101. In some embodiments,the protruded portion 104 b is in a stepped configuration.

In some embodiments as in FIG. 3A, the protruded portion 104 b has aheight H_(first step) running from a top surface 104 a of the molding104 to an interface between the molding 104 and the passivation 106. Theheight H_(first step) is substantially the same as a thickness of thepolymer 105. In some embodiments, the height H_(first step) is about 1um to about 15 um. In some embodiments, the height H_(first step) isabout 0.5 um to about 20 um.

In some embodiments, the protruded portion 104 b has a lengthL_(first step) which is a shortest straight distance between thesidewall 101 b of the die 101 and a point 100 a intersecting with theprotruded portion 104 b, the polymer 105 and the passivation 106. Insome embodiments, the length L_(first step) is extended from the edge ofthe die 101 towards the polymer 105. In some embodiments, the lengthL_(first step) is about 5 um to about 15 um. In some embodiments, thelength L_(first step) is about 1 um to about 20 um.

In some embodiments, the molding 104 includes an angled interface 104 cbetween the polymer 105 and the protruded portion 104 b of the molding104. In some embodiments, the angled interface 104 c is in a tilted ortapered configuration. There is an angle θ between the angled interface104 c and passivation 106. In some embodiments, the angle θ is about 30degrees to about 110 degrees. In some embodiments, the angle θ is about10 degrees to about 130 degrees. In some embodiments, a portion of thepolymer 105 overlays a portion of the molding 104 adjacent to the edgeof the die 101 when the angle θ is less than about 90 degrees as in FIG.3. In some embodiments, a portion of the molding 104 overlays a portionof the polymer 105 adjacent to the edge of the die 101 when the angle θis greater than about 90 degrees.

In some embodiments, the molding 104 includes an extended portion 104 dadjacent to the edge of the die 101. The extended portion 104 d isextended from the edge of the die 101 towards the passivation 106.

In some embodiments as in FIG. 3A, the extended portion 104 d has alength extending from the sidewall 101 b of the die 101 to thepassivation 106. In some embodiments, the length L_(second step) of theextended portion 104 d is about 2 um to about 6 um. In some embodiments,the length L_(second step) is about 1 um to about 10 um. In someembodiments, the extended portion 104 d is in a stepped configuration.

In some embodiments, the molding 104 includes a molding compound. Themolding compound can be a single layer film or a composite stack. Themolding compound includes various materials, for example, one or more ofepoxy resins, phenolic hardeners, silicas, catalysts, pigments, moldrelease agents, and the like. Each of the materials for forming amolding compound has a high thermal conductivity, a low moistureabsorption rate, a high flexural strength at board-mountingtemperatures, or a combination of these.

In some embodiments as in FIG. 3, a top surface 104 a of the molding 104is substantially in a same level as a top surface 105 b of the polymer105. The top surface 104 a of the molding 104 and the top surface 105 bof the polymer 105 are in cooperation to configure as a first flatinterface 100 b for receiving other components or materials of thesemiconductor device 100 such as polymeric materials, dielectricmaterials, conductive materials, or etc. In some embodiments, the firstflat interface 100 b is a horizontally flattened surface which is absentfrom any stepping, stagger or tilting. The first flat interface 100 bruns along a horizontal plane from one side of the semiconductor deviceto another opposite side of the semiconductor device 100.

As in FIG. 3, the polymer 105 disposed over the die 101 compensates astepping between the die 101 and the molding 104, so that the first flatinterface 100 b is configured on top of the semiconductor device 100 forsubsequently disposing other components or materials thereon. Such aflat interface configuration by disposition of the polymer 105 betweenthe stepping of the die 101 and the molding 104 improves the smoothnessof the top of the semiconductor device 100 and thus prevent delaminationof components or materials.

FIG. 4 is an embodiment of a semiconductor device 100. The semiconductordevice 100 includes a die 101, a pad 103, a first polymer 105, a molding104 and a second polymer 107. The pad 103 is disposed OR the die 101 andelectrically coupled with a bump through a conductive material attachedon the pad 103. The first polymer 105 is disposed over the die 101 andis patterned to provide a path for the conductive material passingthrough. The molding 104 surrounds the die 101 and the first polymer105. The second polymer 107 is disposed on the first polymer 105 and themolding 104. The configuration of the die 101 the pad 103, the firstpolymer 105 and the molding 104 are with reference to FIGS. 1, 2 and 3.

In some embodiments, the first polymer 105 includes a first recessedportion 105 a above the pad 103. The first recessed portion 105 a isconfigured bar the conductive trace passing through in order toelectrically connect the pad 103 with the circuitry external to the die101.

In some embodiments, the second polymer 107 is disposed on the firstpolymer 105 and the molding 104 along the first flat interface 100 b tocover the die 101. The second polymer 107 runs horizontally from oneside of the semiconductor device 100 to another opposite side of thesemiconductor device 100 along the first flat interface 100 b in absenceof stepping, stagger or tilting as in FIG. 4. In some embodiments, thesecond polymer 107 is configured with a second flat interface 100 csubstantially parallel to the first flat interface 100 b. The secondflat interface 100 c is configured for receiving other components ormaterials of the semiconductor device 100 such as polymeric materials,dielectric materials, conductive materials, or etc. In some embodiments,the second flat interface 100 c is a horizontally flattened surfacewhich is absent from any stepping, stagger or tilting.

In some embodiments, some of the second polymer 107 is disposed withinthe first recessed portion 105 a adjacent to the pad 103. Some of thesecond polymer 107 in first recessed portion 105 a and opening 106 a issurrounded by first polymer 105 and passivation 106. In someembodiments, the second polymer 107 includes a polymeric material suchas epoxy, polyimide, polybenzoxazole (PBO), solder resist (SR), ABFfilm, and the like. In some embodiments, the first polymer 105 includesdifferent materials from the second polymer 107. In some embodiments,the second polymer 107 has a lower curing temperature than the firstpolymer 105. In other words, the first polymer 105 is able to sustainunder a higher temperature than the second polymer 107.

In some embodiments as in FIG. 5, the second polymer 107 includes asecond recessed portion 107 a. In some embodiments, the second recessedportion 107 a is configured for receiving a conductive material such asthe conductive trace so as to electrically connect the pad 103 with thecircuitry external to the die 101 through the second recessed portion107 a.

In some embodiments, the second polymer 107 is patterned by severaloperations to form the second recessed portion 107 a within the firstrecessed portion 105 a adjacent to the pad 103. In some embodiments, thesecond polymer 107 is patterned by photolithography, that a photoresistmaterial is disposed on the second polymer 107 to cover some of thesecond polymer 107 and the photoresist material is partially exposedthrough a photomask in order to etch away some of the second polymer 107without coverage of the photoresist material, so that the second polymer107 includes the second recessed portion 107 a.

In some embodiments, the first recessed portion 105 a of the firstpolymer 105 is larger than the second recessed portion 107 a of thesecond polymer 107, so that the second recessed portion 107 a is withinthe first recessed portion 105 a. A sidewall 107 c of the secondrecessed portion 107 a covers the first recessed portion 105 a. In someembodiments, the first recessed portion 105 a of the first polymer 105has a width W_(first) of about 20 um to about 60 um. In someembodiments, the first recessed portion 105 a of the first polymer 105has a width W_(first) of about 10 um to 80 um. In some embodiments, thesecond recessed portion 107 a of the second polymer 107 has a widthW_(second) of about 10 um to 20 um. In some embodiments, the secondrecessed portion 107 a of the second polymer 107 has a width W_(second)of about 5 um to 30 um.

In some embodiments, the first recessed portion 105 a of the firstpolymer 105 and the second recessed portion 107 a of the second polymer107 are in a tapered configuration. The first recessed portion 105 a andthe second recessed portion 107 a are tapered towards the pad 103. Thefirst recessed portion 105 a is getting narrower from the top surface105 b towards the top surface 103 a of the pad 103. The second recessedportion 107 a is getting narrower from the top surface 107 b towards thetop surface 103 a of the pad 103.

In some embodiments as in FIG. 6, a conductive material 108 is disposedon the second polymer 107. The conductive material 108 is disposedwithin the second recessed portion 107 a and on the top surface 107 b ofthe second polymer 107. The conductive material 108 couples with the pad103, so that the pad 103 can be electrically connected with thecircuitry external to the die 101 through the conductive material 108.

In some embodiments, the conductive material 108 is disposed on thesecond polymer 107 along a second flat interface 100 c in absence ofstepping, stagger or tilting as in FIG. 6. In some embodiments, thefirst flat interface 100 b between the first polymer 105, the molding104 and the second polymer 107 is substantially parallel to the secondflat interface 100 c between the second polymer 107 and the conductivematerial 108.

In some embodiments, the conductive material 108 is configured with athird flat interface 100 d substantially parallel to the first flatinterface 100 b and the second flat interface 100 c. The third flatinterface 100 d is configured for receiving other components ormaterials of the semiconductor device 100 such as polymeric materials,dielectric materials, conductive materials, or etc. In some embodiments,the third flat interface 100 d is a horizontally flattened surface whichis absent from any stepping, stagger or tilting. In some embodiments,the conductive material 108 includes a third recessed portion 108 awhich is disposed within the first recessed portion 105 a and the secondrecessed portion 107 a.

In some embodiments, the conductive material 108 is a redistributionlayer (RDL) 108. The RDL 108 is an electrical connection to and/orbetween the die 103 and the circuitry external to the die 101. The RDL108 re-routes a path of a circuit from the pad 103 to the circuitryexternal to the die 101. In some embodiments, the conductive material108 is patterned to act as an inductor. In some embodiments, theconductive material 108 includes a conductive material such as gold,silver, copper, nickel, tungsten, aluminum, and/or alloys thereof.

In some embodiments as in FIG. 7, a third polymer 109 is disposed on theconductive material 108 and the second polymer 107. The third polymer109 runs horizontally from one side of the semiconductor device 100 toanother opposite side of the semiconductor device 100 along the secondflat interface 100 c and the third flat interface 100 d.

In some embodiments, the third polymer 109 is configured with a topsurface 100 e substantially parallel to the third flat interface 100 d.In some embodiments, the third polymer 109 includes a fourth recessedportion 109 a for receiving a conductive material such as copper or etc.In some embodiments, the third polymer 109 includes a polymeric materialsuch as epoxy, polyimide, polybenzoxazole (PBO), solder resist (SR), ABFfilm, and the like.

In some embodiments, an under bump metallurgy (UBM) 110 is disposed onthe conductive material 108 as in FIG. 8. In some embodiments, the UBM110 is disposed on the third polymer 109 and the conductive material108. The UBM 110 is disposed within the fourth recessed portion 109 a(refer to FIG. 7) and on the top surface 100 e of the third polymer 109.The UBM 110 is a solderable surface which is exposed for receiving abump 111 and electrically connecting the pad 103 with the circuitryexternal to the die 101 through the conductive material 108 and the bump111. In some embodiments, the bump 111 is a solder bump, solder ball,solder paste or etc. In some embodiments, the third flat interface 100 dbetween the conductive material 108 and the UBM 110 is substantiallyparallel to the first flat interface 100 b and the second flat interface100 c.

In some embodiments, the UBM 110 has a flat portion 110 b which issubstantially parallel to the third flat interface 100 d and ishorizontally disposed on the conductive material 108 as in FIG. 8. Insome embodiments, the UBM 110 includes a fifth recessed portion 110 awhich is configured for receiving and attaching the bump 111 thereon. Insome embodiments, the bump 111 is attached on the UBM 110 after heattreatment operations such as reflow.

FIG. 9 is an embodiment of a semiconductor package 200. Thesemiconductor package includes a die 101 including a pad 103 disposed ontop of the die 101 and coupled with interconnections in the die 101, apolymer 105 over the die 101 including a recessed portion 105 a, amolding 104 surrounding the die 101 and the polymer 105, and aconductive trace 108 external to the die 101 and including a recessedportion 108 a on the pad 103 and a flat portion 108 b over the polymer105. The recessed portion 108 a of the conductive trace 108 is throughthe polymer 105 and in direct contact with the pad 103, the flat portion108 b is connected with the recessed portion 108 a of the conductivetrace 108 at one end, and is routed to electrically coupled with a bump111 located at a level over a UBM 110, and is over the polymer 105.

In the present disclosure, a method of manufacturing a semiconductordevice is also disclosed. In some embodiments, a semiconductor device isformed by a method 200. The method 200 includes a number of operationsand the description and illustration are not deemed as a limitation asthe sequence of the operations.

FIG. 10 is an embodiment of a method 200 of manufacturing asemiconductor device. The method 200 includes a number of operations(201, 202, 203, 204, 205, 206, 207, 208, 209, 210, 211, 212, 213, 214,215, 216).

In operation 201, a wafer 114 is provided as in FIG. 10A. In someembodiments, the wafer 114 is formed by a semiconductor material such assilicon. In operation 202, a pad 103 is formed on the wafer 114 as inFIG. 10A. In some embodiments, the pad 103 is disposed on a surface ofthe wafer 114.

In operation 203, a first polymer 105 is disposed on the wafer 114 as inFIG. 10A. In some embodiments, the first polymer 105 is disposed on thepad 103 to cover the surface of the wafer 114.

In operation 204, the first polymer 105 is patterned with an opening 113above the pad 103 as in FIG. 10B. The first polymer 105 is patterned toprovide a path for a conductive material or conductive trace passingthrough. In some embodiments, the first polymer 105 is patterned to formthe opening 113 by photolithography. A photoresist material is disposedon the polymer 105 to cover the first polymer 105, and then thephotoresist material is partially exposed through a photomask in orderto etch away those first polymer 105 adjacent to the pad 103, so thatthe opening 113 is formed above the pad 103.

In operation 205, a sacrificial layer 112 is disposed over the patternedfirst polymer 105 as in FIG. 10C. In some embodiments, the sacrificiallayer 112 is disposed on the patterned first polymer 105 to cover thefirst polymer 105 and the opening 113. In some embodiments, thesacrificial layer 112 includes a polymeric material such as such asepoxy, polyimide, polybenzoxazole (PBO), solder resist (SR), ABF film,and the like.

In operation 206, the wafer 114 is singulated into several individualdies 101 as in FIG. 10D. In some embodiments, the wafer 114 issingulated by a mechanical or laser blade. In operation 207, the die 101singulated from the wafer 114 is placed on a carrier 102 as in FIG. 10E.The die 101 is disposed on a surface 102 a of the carrier 102.

In operation 208, a molding 104 is disposed on the carrier 102 tosurround the die 101 as in FIG. 10F. The molding 104 encapsulates thedie 101. The molding 104 is disposed on a surface 102 a of the carrier102, a surface 112 a of the sacrificial layer 112 and a sidewall 101 bof the die 101. The molding 104 covers the die 101 in order to protectthe die 101 from damages and isolate the die 101 from an ambientenvironment. In some embodiments, the molding 104 is made from a moldingcompound or a plastic material. In some embodiments, the moldingcompound fills the surrounding of the die 101 and then is cured by aheat treatment so as to solidify the molding compound to become themolding 104 encapsulating the die 101.

In operation 209, a top portion of the molding 104 is removed therebyexposing the sacrificial layer 112 as in FIG. 10G. In some embodiments,the top portion of the molding 104 is removed by operations such asetching or grinding. The top portion of the molding 104 is removed fromthe top of the molding 104 towards the die 101 along a verticaldirection until the sacrificial layer 112 is reached, so that a topsurface 112 a of the sacrificial layer 112 is exposed. In someembodiments, the molding 104 is ground until the top surface 112 a ofthe sacrificial layer 112 is exposed and is substantially in a samelevel as a top surface 104 a of the molding 104. In some embodiments,the sacrificial layer 112 is configured to protect the first polymer 105from damage during grinding.

In operation 210, the sacrificial layer 112 is removed thereby exposingthe pad 103 and the first polymer 105 as in FIG. 10H. In someembodiments, the sacrificial layer 112 is removed by etching operations.A top surface 105 b of the first polymer 105 is exposed and the pad 103is exposed through the opening 113. In some embodiments, the sacrificiallayer 112 is etched away and the top portion of the molding 104 isfurther ground towards the die 101. In some embodiments, the molding 104is ground until the top surface 104 a of the molding 104 issubstantially in a same level as the top surface 105 b of the firstpolymer 105.

In operation 211, a second polymer 107 is disposed on the first polymer105 as in FIG. 10I. In some embodiments, the second polymer 107 isdisposed over the die 101 and is on the top surface 105 b of the firstpolymer 105 and the top surface 104 a of the molding 104.

In operation 212, the second polymer 107 is patterned with the opening113 above the pad 103 as in FIG. 10I. In some embodiments, the secondpolymer 107 adjacent to the opening 113 above the pad 103 is removed byetching operations, so that the second polymer 107 is patterned with theopening 113 above the pad 103. The pad 103 is exposed through theopening 113 from the first polymer 105 to the second polymer 107.

In operation 213, a conductive material 108 is disposed on the pad 103within the opening 113 to form a UBM 110 as in FIG. 10I. In someembodiments, the conductive material 108 fills the opening 113, disposeson the top surface 103 a of the pad 103 and the second polymer 107 andextends along a portion of a top surface 107 b of the second polymer 107to form the UBM 110. In some embodiments, the conductive material 108 isa conductive trace for electrically connecting the pad 103 and the UBM110 through the opening 113. In some embodiments, the conductivematerial 108 is a redistribution layer (RDL) for re-route a path of acircuitry from the pad 103 to the circuitry external to the die 101. Insome embodiments, the UBM 110 is configured for receiving a bump on aflat portion 110 b of the UBM 110. The flat portion 110 b of the UBM 110is exposed for receiving the bump.

In operation 214, a third polymer 109 is disposed on the conductivematerial 108 and the second polymer 107 as in FIG. 10I. The thirdpolymer 109 covers the second polymer 107 and the conductive material108. In operation 215, the third polymer 109 is patterned with theopening 113 above the UBM 110 as in FIG. 10I. In some embodiments, thethird polymer 109 adjacent to the UBM 110 is removed by etchingoperations, so that the third polymer 109 is patterned with the opening113 above the UBM 110, as such the UBM 110 is exposed for receiving thebump.

In operation 216, the hump 111 is disposed on the UBM 110 as in FIG.10J. The bump 111 is attached on the flat portion 110 b of the UBM 110,so that the pad 103 is electrically connected with the bump 111 throughthe conductive material 108 from the die 101 to the external circuitry.In some embodiments, the bump 111 is configured for bonding on a bondpad of the external circuitry within a printed circuit board (PCB), sothat the semiconductor device 100 is bonded on the PCB, as such thecircuitry of the die is electrically connected with the externalcircuitry of the PCB.

In some embodiments, a semiconductor device includes a die, a paddisposed on the die and configured to be electrically coupled with abump through a conductive trace attached on the pad, a polymer disposedover the die and patterned to provide a path for the conductive tracepassing through, and a molding surrounding the die and the polymer. Atop surface of the molding is substantially in a same level as a topsurface of the polymer, in some embodiments, the molding includes aprotruded portion adjacent to an edge of the die and disposed betweenthe polymer and the die. In some embodiments, the protruded portion ofthe molding has a height substantially the same as a thickness of thefirst polymer. In some embodiments, the height of the protruded portionof the molding is about 1 um to about 15 um. In some embodiments, alength of the protruded portion of the molding extended from the edge ofthe die towards the polymer is about 5 um to about 15 um. In someembodiments, an angled interface between the polymer and the protrudedportion of the molding is in an angle about 30 degrees to about 110degrees. In some embodiments, a passivation over the die and the pad. Insome embodiments, the molding includes an extended portion adjacent toan edge of the die and disposed between the passivation and the die. Insome embodiments, the extended portion of the molding extended from theedge of the die towards the passivation is about 2 um to about 6 um.

In some embodiments, a semiconductor device includes a die, a paddisposed on the die and configured to be electrically coupled with abump through a conductive trace attached on the pad, a polymer disposedover the die and patterned to provide a path for the conductive tracepassing through, a molding surrounding the die and the polymer; whereina top surface of the molding is substantially in a same level as a topsurface of the polymer. In some embodiments, the molding includes aprotruded portion adjacent to an edge of the die and disposed betweenthe polymer and the die. In some embodiments, the protruded portion ofthe molding has a height substantially the same as a thickness of thefirst polymer. In some embodiments, the height of the protruded portionof the molding is about 1 um to about 15 um. In some embodiments, alength of the protruded portion of the molding extended from the edge ofthe die towards the polymer is about 5 um to about 15 um. In someembodiments, an angled interface between the polymer and the protrudedportion of the molding is in an angle about 30 degrees to about 110degrees. In some embodiments, the semiconductor device further includesa passivation over the die and the pad. In some embodiments, the moldingincludes an extended portion adjacent to an edge of the die and disposedbetween the passivation and the die. In some embodiments, the extendedportion of the molding extended from the edge of the die towards thepassivation is about 2 um to about 6 um.

In some embodiments, a semiconductor device includes a die, a paddisposed on the die and electrically coupled with a bump through aconductive material attached on the pad, a first polymer disposed overthe die and patterned with an opening over the pad for the conductivematerial passing through, a molding surrounding the die and the firstpolymer, a second polymer disposed between the conductive material, thefirst polymer and the molding, the first polymer includes a firstrecessed portion over the pad, and the second polymer includes a secondrecessed portion over the pad, the first recessed portion surroundingthe second recessed portion. In some embodiments, the first recessedportion of the first polymer is larger than the second recessed portionof the second polymer. In some embodiments, the first recessed portionof the first polymer has a width of about 20 um to about 60 um. In someembodiments, the second recessed portion of the second polymer has awidth of about 10 um to about 20 um. In some embodiments, the firstrecessed portion of the first polymer or the second recessed portion ofthe second polymer is in a tapered configuration. In some embodiments, afirst flat interface between the first polymer, the molding and thesecond polymer is substantially parallel to a second flat interfacebetween the second polymer and the conductive material. In someembodiments, the semiconductor further includes an under bump metallurgy(UBM) disposed on the conductive material. In some embodiments, a thirdflat interface between the conductive material and the UBM issubstantially parallel to the first flat interface and the second flatinterface.

In some embodiments, a method of manufacturing a semiconductor deviceincludes providing a die, forming a pad on the die, disposing a firstpolymer over the die, patterning the first polymer with an opening overthe pad, disposing a sacrificial layer over the patterned first polymer,disposing a molding surrounding the die, removing a portion of themolding thereby exposing the sacrificial layer, removing the sacrificiallayer thereby exposing the pad and the first polymer, disposing a secondpolymer on the first polymer, patterning the second polymer with theopening over the pad, and disposing a conductive material on the padwithin the opening. In some embodiments, the patterning the firstpolymer is performed by photolithography operations. In someembodiments, the removing the sacrificial layer is performed by etchingoperations.

The methods and features of this invention have been sufficientlydescribed in the above examples and descriptions, it should beunderstood that any modifications or changes without departing from thespirit of the invention are intended to be covered in the protectionscope of the invention.

Moreover, the scope of the present application in not intended to belimited to the particular embodiments of the process, machine,manufacture, and composition of matter, means, methods and stepsdescribed in the specification. As those skilled in the art will readilyappreciate from the disclosure of the present disclosure, processes,machines, manufacture, composition of matter, means, methods or stepspresently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein maybe utilized according tothe present disclosure.

Accordingly, the appended claims are intended to include within theirscope such as processes, machines, manufacture, compositions of matter,means, methods or steps. In addition, each claim constitutes a separateembodiment, and the combination of various claims and embodiments arewithin the scope of the invention.

What is claimed is:
 1. A method of manufacturing a semiconductor device,comprising: providing a die; forming a pad on the die; disposing a firstpolymer over the die; patterning the first polymer with a first openingover the pad; disposing a sacrificial layer over the first polymer;disposing a molding surrounding the die; removing a portion of themolding thereby exposing the sacrificial layer; removing the sacrificiallayer thereby exposing the pad and the first polymer, wherein a topsurface of the first polymer is substantially in a same level as a topsurface of the molding; disposing a second polymer on the first polymer;patterning the second polymer with a second opening disposed over thefirst opening and the pad; and disposing a conductive material on thepad within the first opening and the second opening.
 2. The method ofclaim 1, wherein the first polymer is surrounded by the molding.
 3. Themethod of claim 1, wherein a portion of the pad is exposed from thefirst polymer.
 4. The method of claim 1, wherein the first opening isdisposed between the sacrificial layer and the pad.
 5. The method ofclaim 1, wherein the sacrificial layer includes a polymeric material. 6.The method of claim 1, wherein the molding is disposed over thesacrificial layer.
 7. The method of claim 1, wherein the patterning thefirst polymer is performed by photolithography and etching operations.8. The method of claim 1, wherein the removing the sacrificial layer isperformed by etching operations.
 9. The method of claim 1, wherein theremoving the portion of the molding is performed by etching or grindingoperations.
 10. The method of claim 1, wherein the molding is curedafter the disposing of the molding.
 11. A method of manufacturing asemiconductor device, comprising: providing a die including a paddisposed over the die; disposing a patterned first polymer over the die;disposing a sacrificial layer over the patterned first polymer;disposing a molding around the die, the patterned first polymer and thesacrificial layer; and removing the sacrificial layer and a portion ofthe molding, wherein the patterned first polymer and a portion of thepad are exposed from the molding, and a top surface of the patternedfirst polymer is substantially in a same level as a top surface of themolding.
 12. The method of claim 11, wherein the patterned first polymerincludes an opening disposed over the portion of the pad.
 13. The methodof claim 11, further comprising forming a redistribution layer (RDL)over the molding and the die.
 14. The method of claim 11, wherein thesacrificial layer includes epoxy, polyimide, polybenzoxazole (PBO) orsolder resist.
 15. A method of manufacturing a semiconductor device,comprising: providing a carrier; providing a die including a paddisposed over the die, a patterned first polymer disposed over the pad,and a sacrificial layer disposed over the patterned first polymer;disposing the die over the carrier; forming a molding to surround thedie; removing the sacrificial layer, wherein a top surface of thepatterned first polymer is substantially in a same level as a topsurface of the molding; disposing a patterned second polymer over thepatterned first polymer and the molding; and disposing a conductivematerial over the pad and the patterned second polymer.
 16. The methodof claim 15, wherein the carrier is removable from the die and themolding.
 17. The method of claim 15, further comprising disposing aconductive bump over the conductive material.
 18. The method of claim15, wherein the patterned second polymer includes an opening filled bythe conductive material.
 19. The method of claim 15, further comprisingforming an under bump metallization (UBM) over the conductive material.